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The
Heterogeneous
Integration
Knowledge
Team.

At THInK Team, we focus on enabling heterogeneous integration of systems. We deep dive into fine-pitch integration platforms and generate design methodologies, circuits, and EDA tools to increase system performance, reduce energy footprint, and enable novel applications.

Our work can be found on Google Scholar.

Follow us for updates from THInK Team LinkedIn Page.

Latest News

THInK Team attends DAC 2026!

24 July 2026 | Our PI, Boris, will be attending DAC, The Chips to Systems Conference, July 26-29, 2026. Click for details.

New paper update!

27 June 2026 | Excellent collaborative work by the team on addressing the communication bottleneck in chiplet-based LLM accelerators. Click for details.

Best Poster Award!

22 June 2026 | Our paper receives the Best Poster Award at 2026 36th Great Lakes Symposium on VLSI (GLSVLSI). Click for details.

New paper update!

15 November 2025 | Fahad will be presenting at ASP-DAC 2025. Click for details.

Boris moves to UC Irvine!

1 October 2024 | Boris moves to UC Irvine Click for details.