Invited Talks

• B. Vaisband (Panelist), “Will Hardware Engineers Also Lose Jobs to Generative AI?,” ACM Great Lakes Symposium on VLSI (GLSVLSI), June 2026.
• B. Vaisband, “Designing Chiplet-Based Heterogeneous Integration Systems,” Qualcomm, March 2026.
• B. Vaisband (Panelist), “,” Keysight Wireless and Digital Health Seminar, February 2026.
• B. Vaisband (Panelist), “Scaling Beyond Moore's Law: Heterogeneous Computing and Advanced Packaging,” ASM International Symposium for Testing and Failure Analysis (ISTFA), November 2025.
• B. Vaisband, “Chiplet-Based Heterogeneous Integration for Ultra-Large-Scale Applications,” University of California, Riverside Technical Seminar Series, November 2025.
• B. Vaisband, “Chiplet-Based Heterogeneous Integration for Ultra-Large-Scale Applications,” CA DREAMS, Microelectronics Commons Hub Technical Seminar Series, October 2025.
• B. Vaisband, “Chiplet-Based Heterogeneous Integration for Ultra-Large-Scale Applications,” IEEE EPS Orange County Chapter, September 2025.
• B. Vaisband, “Thermal Management in Advanced Packaging,” Ansys, May 2025.
• B. Vaisband, “Chiplet-Based Integration: Scale-Down and Scale-Out,” ACM International Symposium on Physical Design (ISPD), March 2025.
• B. Vaisband (Panelist), “,” SEMI Workshop on Future of Computing: Sustainable AI Systems, March 2025.
• B. Vaisband, “Chiplet-Based Heterogeneous Integration for High-Performance Compute Systems,” ECE Department Seminar, Villanova University, February 2025.
• B. Vaisband, “Chiplet-Based Heterogeneous Integration,” IEEE EPS Chapter, University of Waterloo, May 2023.
• B. Vaisband, “Chiplet-Based Heterogeneous Integration,” Microelectronics Seminar Course, Bar-Ilan University, June 2022.
• B. Vaisband (Keynote Speaker), “Chiplet-Based Heterogeneous Integration,” IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH), November 2021.
• B. Vaisband, “Wafer-Scale Heterogeneous Integration,” IEEE Joint EPS/EMC, Montreal Chapter, April 2021.
• S. S. Iyer and B. Vaisband, “Silicon Interconnect Fabric: A Paradigm Shift in Heterogeneous Integration,” CMC Microsystems Webinar, June 2020.
• B. Vaisband, “Silicon Interconnect Fabric: A Versatile Heterogeneous Integration Platform,” MiQro Innovation Collaborative Centre (C2MI), Bromont, QC March 2020.
• B. Vaisband, “Design of Ultra-Large Wafer-Level Systems,” International System-on-Chip Conference, October 2018.
• B. Vaisband, “A Network for Silicon Interconnect Fabric,” International Symposium on Microelectronics (IMAPS), October 2018.
• B. Vaisband, “Silicon Interconnect Fabric: A Platform for Heterogeneous Integration,” ASCENT (SRC JUMP Center) Annual Review, August 2018.