Invited Talks

B. Vaisband, “Silicon Interconnect Fabric: A Chiplet-Based Advanced Packaging Platform for AI Applications,” IEEE Silicon Lifecycle Management Workshop, co-located with the IEEE International Test Conference (ITC), October 2026.
B. Vaisband, “Near Real-Time Spike-Driven Synaptic Plasticity for CTT-Based Neuromorphic Systems,” IEEE Cross-disciplinary Conference on Memory-Centric Computing (CCMCC), October 2026.
B. Vaisband, “Designing Ultra-Large-Scale Chiplet-Based Systems for AI Applications,” University of Arizona Technical Seminar Series, August 2026.
B. Vaisband (Panelist), “Will Hardware Engineers Also Lose Jobs to Generative AI?,” ACM Great Lakes Symposium on VLSI (GLSVLSI), June 2026.
B. Vaisband, “Designing Chiplet-Based Heterogeneous Integration Systems,” Qualcomm, March 2026.
B. Vaisband (Panelist), Keysight Wireless and Digital Health Seminar, February 2026.
B. Vaisband (Panelist), “Scaling Beyond Moore's Law: Heterogeneous Computing and Advanced Packaging,” ASM International Symposium for Testing and Failure Analysis (ISTFA), November 2025.
B. Vaisband, “Chiplet-Based Heterogeneous Integration for Ultra-Large-Scale Applications,” University of California, Riverside Technical Seminar Series, November 2025.
B. Vaisband, “Chiplet-Based Heterogeneous Integration for Ultra-Large-Scale Applications,” CA DREAMS, Microelectronics Commons Hub Technical Seminar Series, October 2025.
B. Vaisband, “Chiplet-Based Heterogeneous Integration for Ultra-Large-Scale Applications,” IEEE EPS Orange County Chapter, September 2025.
B. Vaisband, “Thermal Management in Advanced Packaging,” Ansys, May 2025.
B. Vaisband (Panelist), SEMI Workshop on Future of Computing: Sustainable AI Systems, March 2025.
B. Vaisband, “Chiplet-Based Integration: Scale-Down and Scale-Out,” ACM International Symposium on Physical Design (ISPD), March 2025. Link
B. Vaisband, “Chiplet-Based Heterogeneous Integration for High-Performance Compute Systems,” ECE Department Seminar, Villanova University, February 2025.
B. Vaisband, “Chiplet-Based Heterogeneous Integration,” IEEE EPS Chapter, University of Waterloo, May 2023.
B. Vaisband, “Chiplet-Based Heterogeneous Integration,” Microelectronics Seminar Course, Bar-Ilan University, June 2022.
B. Vaisband (Keynote Speaker), “Chiplet-Based Heterogeneous Integration,” IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH), November 2021.
B. Vaisband, “Wafer-Scale Heterogeneous Integration,” IEEE Joint EPS/EMC, Montreal Chapter, April 2021.
S. S. Iyer and B. Vaisband, “Silicon Interconnect Fabric: A Paradigm Shift in Heterogeneous Integration,” CMC Microsystems Webinar, June 2020.
B. Vaisband, “Silicon Interconnect Fabric: A Versatile Heterogeneous Integration Platform,” MiQro Innovation Collaborative Centre (C2MI), Bromont, QC, March 2020.
B. Vaisband, “Design of Ultra-Large Wafer-Level Systems,” International System-on-Chip Conference, October 2018.
B. Vaisband, “A Network for Silicon Interconnect Fabric,” International Symposium on Microelectronics (IMAPS), October 2018.
B. Vaisband, “Silicon Interconnect Fabric: A Platform for Heterogeneous Integration,” ASCENT (SRC JUMP Center) Annual Review, August 2018.