SoCal CHIPS Symposium 2027

It is our pleasure to invite you to the inaugural SoCal CHIPS Symposium on Wednesday January 27, 2027, that will be held at the University of California, Irvine. This event marks the expansion of UCLA CHIPS in Southern California and the natural integration of advanced packaging with system-level design. The promise of advanced packaging technologies is upon us; the future lies in enablement and scaled fabrication. We aim to bring together the packaging and design communities to co-design functional systems on emerging heterogeneous integration platforms.

The symposium will include talks by industry leaders on various advanced packaging technologies as well as design challenges in scaled-out and physical AI systems. As always, we believe that our most important product is our students and scholars. We will feature posters presented by our students, on the topics of process development, integration, and enablement for heterogeneous integration systems. These graduates and scholars are making a significant impact in our industry and academia across the world.

Today, more than ever, industry and academia collaborations are critical to the continued efficient training of highly qualified personnel to close the increasing workforce gap in the integrated circuit design and packaging industries in the U.S.

The symposium is free, but registration is required as space is limited.

The meeting will be held at The Cove @ UCI.